Description
Mechanic XG30 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It has a low melting point of 183°C, making it easy to use and preventing the solder from solidifying before it can be applied. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
- Alloy Sn63 / Pb37
- Rosin flux IPX3
- Microns 3#
- Produces high-quality solder joints
Benefits:
- Repairs PCB circuit boards
- Solders electronic components
- Performs BGA welding
- Repairs mobile phones
- Easy to use
- Produces high-quality solder joints
- Consistent and reliable performance
Applications:
- PCB repair
- Electronic component soldering
- BGA welding
- Mobile phone repair
