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IVES Lead-Free BGA Ball Mounting Flux Paste is a high-quality, lead-free solder paste that is ideal for mobile phone repair, chip planting, and electronic component soldering applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Features: Lead-free Tin-silver-copper alloy Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for BGA ball mounting, mobile phone repair, chip planting, and electronic component soldering applications Small size, easy to carry Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Portable and easy to carry Applications: BGA ball mounting Mobile phone repair Chip planting Electronic component soldering

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IVES 100g Lead-Free BGA Solder Paste is a high-quality, no-clean flux paste that is ideal for PCB, mobile phone repair, soldering, and rework applications. It is made with lead-free solder and a wash-free rosin flux, which makes it environmentally friendly and easy to use. The solder paste has a high activity and low halogen content, making it ideal for use in a variety of electronic products. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Here are some of the key features of the IVES BGA Solder Paste: Lead-free solder, Wash-free rosin flux Environmentally friendly, Easy to use High activity, Low halogen content Viscosity and graininess controlled Ideal for PCB, mobile phone repair, soldering, and rework applications

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IVES BGA Soldering Paste is widely used in electronic products such as PCB, BGA, CSP and other packagers. For repair welding and rework areas. Low halogen content. In line with industry standards. has ability, It quickly remove the oxide layer on metal surface. It has less welding residue and is no-clean product. It is a premium solution for flawless mobile phone maintenance and precise soldering applications. This lead-free solder paste is engineered to meet the highest standards in chip rework and motherboard soldering. With wash-free flux formula, you can achieve impeccable results without the need for additional cleaning steps. Key Features: Brand: IVES Item Number: BGA Solder Paste Model: IVES-559-TF Viscosity: 100 (Pa·S) Graininess: 0 (um) Melting Point: 180°C Type: BGA Solder Paste Operating Temperature: Up to 300°C Wide Application: From delicate PCBs to advanced BGAs and more, our IVES BGA Solder Paste is the go-to choice for professionals in need of reliable and precise soldering solutions. Achieve pristine results in mobile phone maintenance, chip rework, and various soldering projects. Low Halogen Content, High Standards: Designed with industry standards in mind, our solder paste boasts a low halogen content, meeting environmental regulations while ensuring exceptional soldering performance. Rest easy knowing you're working with a product that aligns with responsible practices. Oxide Layer Removal: Swiftly eliminate oxide layers from metal surfaces. This unique ability enhances soldering connections, contributing to more reliable and robust electronic assemblies. Minimal Residue, No-Clean Formula: This solder paste's reduces welding residue due to its no-clean formulation. This innovative approach streamlines your soldering process, delivering cleaner outcomes and minimizing post-soldering cleaning efforts. With a melting point of 180°C and an operating temperature of up to 300°C, our BGA solder paste offers superior performance across various applications. Its fine graininess ensures precise application even in intricate soldering scenarios. IVES BGA Solder Paste is trusted by professionals worldwide. From its low halogen content to its unmatched soldering capabilities, this lead-free solder paste ensures precision, efficiency, and best soldering practices.

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