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MXJ Lead Solder Paste Syringe Sn63/Pb37 Granularity/Microns 4um for SMT Electronics Repair MXJ-40Z

Description

MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder paste.

Features
Lead solder paste, melting point, 183℃
Viscosity: 100 (Pa·S)
Granularity :4 (um)
Strong viscosity; fine particles; fine paste
Excellent wettability: the surface after being opened for a long time
It is still wet and does not affect welding
Resistant to medium temperature, less residue, strong upper tin, bright soldering spot
Working temperature: 200 (℃)

Product form

MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder... Read more

1 in stock

Dhs. 45.00 Incl. VAT

      Description

      MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder paste.

      Features
      Lead solder paste, melting point, 183℃
      Viscosity: 100 (Pa·S)
      Granularity :4 (um)
      Strong viscosity; fine particles; fine paste
      Excellent wettability: the surface after being opened for a long time
      It is still wet and does not affect welding
      Resistant to medium temperature, less residue, strong upper tin, bright soldering spot
      Working temperature: 200 (℃)

      Reviews

      MXJ Lead Solder Paste Syringe Sn63/Pb37 Granularity/Microns 4um for SMT Electronics Repair MXJ-40Z

      MXJ Lead Solder Paste Syringe Sn63/Pb37 Granularity/Microns 4um for SMT Electronics Repair MXJ-40Z

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