Description
Mechanic XGSP50 is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-lead alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
- Alloy Sn63 Pb37
- Rosin flux IPX3
- Microns 3#
- Easy to use
- Produces high-quality solder joints
- Viscosity and graininess controlled
- Ideal for PCB, mobile phone repair, and BGA welding applications
This product is ideal for use in a variety of applications, including:
- Repairing PCB circuit boards
- Soldering electronic components
- BGA welding
- Mobile phone repair
The Mechanic XGSP50 solder paste is a reliable and effective way to solder electronic components. It is easy to use and provides excellent performance.
