Description
Jaston JSD-3180 No-Clean Lead-Free Soldering Paste is a high-quality, no-clean lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
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Viscosity: 100 mPa·s
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Graininess: 20 μm
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Alloy composition: Rosin
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Melting point: 180°C
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Type: Soldering paste
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Operating temperature: 300°C
Features:
- No-clean
- Lead-free
- Tin-silver-copper alloy
- Rosin flux
- Easy to use
- Produces high-quality solder joints
- Viscosity and graininess controlled
- Ideal for PCB, mobile phone repair, and BGA welding application
- Repairs PCB circuit boards
- Solders electronic components
- Performs BGA welding
- Repairs mobile phones
- No need to clean after use
- Produces high-quality solder joints
- Consistent and reliable performance
Applications:
- PCB repair
- Electronic component soldering
- BGA welding
- Mobile phone repair
