Description
JASTON JSD-18S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Features:
- Lead-based
- Tin-lead alloy
- Rosin flux
- Easy to use
- Produces high-quality solder joints
- Viscosity and graininess controlled
- Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications
- Higher melting point than Jaston JSD-16S
Benefits:
- Repairs PCB circuit boards
- Solders electronic components
- Performs BGA welding
- Repairs mobile phones
- Easy to use
- Produces high-quality solder joints
- Consistent and reliable performance
- Portable and easy to carry
- Ideal for applications where a higher melting point is required
Applications:
- BGA rework
- Mobile phone repair
- Chip planting
- Electronic component soldering
