MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder paste.FeaturesLead solder paste, melting point, 183℃Viscosity: 100 (Pa·S)Granularity :4 (um)Strong viscosity; fine particles; fine pasteExcellent wettability: the surface after being opened for a long timeIt is still wet and does not affect weldingResistant to medium temperature, less residue, strong upper tin, bright soldering spotWorking temperature: 200 (℃)
MXJ-8003 is Leaded & Rosin Flux solder wire Sn63/Pb37. This Leaded solder wire is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.Specification
Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm
Gross Weight 100g
Tin(Sn) 63%, Lead(Pb) 37%
Expansion 75%
Flux 1.0%-3.0% (Flux with Rosin)
Features
Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C
Excellent Tin wire for motherboards & Mobile phones repair works
High tin content, plump solder joints and good soldering ability
Contains rosin with low melting point, continuous core
Raw materials are used, in strict accordance with the requirements of GB3131-82
Suitable for the majority of maintenance masters
Note: Please choose the right size for your requirement before placing your order.
MXJ-8001 is Leaded & Rosin Flux solder wire Sn63/Pb37. This Leaded solder wire is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.Specification
Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm
Gross Weight 50g
Tin(Sn) 63%, Lead(Pb) 37%
Expansion 75%
Flux 1.0%-3.0% (Flux with Rosin)
Features
Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C
Excellent Tin wire for motherboards & Mobile phones repair works
High tin content, plump solder joints and good soldering ability
Contains rosin with low melting point, continuous core
Raw materials are used, in strict accordance with the requirements of GB3131-82
Suitable for the majority of maintenance masters
Note: Please choose the right size for your requirement before placing your order.
